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PCB Capability
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Item
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For the batch
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For the prototype
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Layer（Maximum）
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2-20
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20-38
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Board material type
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FR-4, Ceramic substrate board，Aluminum based board,、High-Tg
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PTFE，PPO ，PPE
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Rogers, etc
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E-65，etc.
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Compound material lamination
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4layer—6layer
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6 layer—8layer
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Maximum dimension
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610mm X 1100mm
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Dimension tolerance
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±0.13mm
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±0.10mm
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Board thickness coverage
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0.2mm--6.00mm
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0.20mm--8.00mm
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Board thickness tolerance ( t≥0.8mm)
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±8%
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±5%
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Board thickness tolerance(t＜0.8mm)
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±10%
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±8%
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DK thickness
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0.076mm--6.00mm
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0.076mm--0.100mm
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Min line width
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0.10mm
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0.075mm
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Min line space
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0.10mm
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0.075mm
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Out layer copper thickness
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8.75um--175um
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8.75um--280um
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Inner layer copper thickness
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17.5um--175um
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8.75um--175um
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Drilling hole diameter
(Mechanical drill)
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0.25mm--6.00mm
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0.15mm--0.25mm
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Finished hole diameter
(Mechanical drill)
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0.20mm--6.00mm
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0.10mm--0.20mm
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Hole diameter tolerance4
(Mechanical drill)
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0.05mm
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Hole position tolerance
(Mechanical drill)
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0.075mm
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0.050mm
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Laser drill hole size
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0.10mm
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0.075mm
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Board thickness and
hole diameter ratio
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10:1
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12:1
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Solder mask type
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GGreen、Yellow、Black、Purple、Blue、White, Red
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Minimum Solder Mask Dam
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0.10mm
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0.075mm
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Minimum size of solder mask
separation ring
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0.05mm
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0.025mm
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Solder mask oil plug hole diameter
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0.25mm--0.60mm
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0.60mm-0.80mm
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Impedance control tolerance
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±10%
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±5%
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Surface finish
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Hot Air Level、ENIG、Immersion silver、Gold plating, Immersion tin、Gold Finger
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Immersion Tin，OSP
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SMT Capability
A、SMT Assembly 、PCB solder assembly
1、All kinds of difficult’s packaging solder ：DSP solder、CSPsolder、Q solder、BGA solder、BGA Planting ball
LGA Solder
2、research sample 's solder
3、PCB solder、SMT paster 、SMT、THT、DIP、Testing
4、PCB wiring
5、purchase all kinds of components for customers
6、CHIP , PCBA's program and functional testing
7、Assembly Electronics finished products
B、We can well done packaging below
1、LGA CBGA PBGA μBGA CSP DSP QFN LLP QFP LCC PLCC SOIC SOJ TSOP
SSOP SOP SOT 0805 0603 0402 0201…and so on
2、Pressure PCI socket (2mm and 3G 's socket) : type A /AB/B/C /D/DE
Pressure：ERNI FCI APFEL HUTING METHOODE AMP MOLEX
C 、The main production equipment
1、 High speed chip mounter：
SamSung, SM321， speed is 0.02 seconds/point ,make 0201 components above, can make 120 kinds of
components at the same time
SamSung ,CP45FV-NEO,0.03seconds/point，make 0201’s component above，can make 120kinds of
components at the sam time
2、 Reflow:
WINPLUS - 8, high temperature, High precision temperature’s control. LCD display interface, lead-free
soldering temperature ± 0.3 degrees Celsius.
3、 Wave soldering:
Japan SA-3JSL，speed 0.5-1.8m/min，Transportation chain Double-hook ,type((entangle claw)，Spray
Cylinder，Substrate sizes 50-350mm 120mm(H)，
Flux device air/capacity of 3 ~ 5Bar/been 18L, heater 1.6m
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